1. 2. 3. material content data sheet sales product name bgb 741l7esd e6327 issued 29. august 2013 ma# MA000509506 package pg-tslp-7-1 weight* 1.58 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal tin 7440-31-5 0.002 0.11 1089 noble metal gold 7440-57-5 0.007 0.42 4223 inorganic material silicon 7440-21-3 0.049 3.13 3.66 31292 36604 leadframe non noble metal nickel 7440-02-0 0.329 20.81 20.81 208121 208121 wire noble metal gold 7440-57-5 0.051 3.20 3.20 32031 32031 encapsulation organic material carbon black 1333-86-4 0.011 0.68 6832 plastics epoxy resin - 0.146 9.22 92231 inorganic material silicondioxide 60676-86-0 0.923 58.43 68.33 584129 683192 leadfinish noble metal gold 7440-57-5 0.032 2.00 2.00 20026 20026 plating noble metal gold 7440-57-5 0.032 2.00 2.00 20026 20026 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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